Project Background
The rapid development of 5G and artificial intelligence is driving technological innovation in various fields, making life and work more convenient and efficient while injecting new momentum and hope into societal progress. These technologies also lead to increasingly integrated electronic devices with higher power consumption and greater heat generation. As a result, there is a growing demand for improved stability and reliability in these devices. However, the heat generated during operation directly affects the performance and reliability of electronic products. Therefore, thermal management has become an urgent issue that needs to be addressed in electronic devices.
Project Requirements
Silicone thermal conductive materials are primarily used to address thermal management issues in electronic devices. They possess advantages such as high elasticity, low stress levels, low thermal resistance, and durability in high temperatures (200°C–350°C). These materials are widely utilized in 5G and AI-related electronic devices. Optical components like optical modules, sensors, and displays have strict requirements regarding the low oil permeability and low volatility of silicone thermal conductive materials. Since these materials contain small molecular polymers with molecular weights ranging from D3 to D10, during the thermal aging process of the materials (e.g., gaskets or gels), these small molecules evaporate. This causes the surface of the silicone material to become dry and hard, thereby reducing its thermal conductivity. Additionally, the evaporated small molecules can form an oily film on the surfaces of optical components, affecting their optical performance. Therefore, reducing oil permeability and volatility is a critical challenge that needs to be addressed in silicone thermal conductive materials.
For over a decade, Chenxi has been the preferred choice for thermal conductive silicone materials. With today’s electronic devices demanding higher performance and stricter heat dissipation requirements, Chenxi continues to innovate by developing new thermal conductive silicone products. To address the challenges associated with low oil permeability and low volatility, Chenxi’s researchers developed CX-3913AB, a thermal conductive silicone gel with reduced oil emission and low volatility. This solution effectively solves these problems.
CX-3913AB passes thermal conductivity reliability tests: thermal shock testing, double 85-degree tests, and heat aging tests. It meets various requirements regarding performance, processing, and operational safety.
Chenshi CX-3913AB thermal conductive silicone gel features low oil permeability and low volatility. Its superior performance and cost-effectiveness make it ideal for providing the stability required by next-generation electronic devices.
