Solution
Consumer Electronics
CX-3180AB -- The “invisible guardian” behind the technology!
Project Background

The recent opening of the Mobile World Congress Barcelona (MWC25) and the release of ChatGPT-4.5 have sparked widespread discussion. Technologies like 5G, AI, and the Internet of Things have once again become the focus of attention. Whether it’s high-power-consuming 5G base stations or AI-driven smart devices, all strive for improved performance and faster speeds. However, this improvement in performance comes with a significant increase in heat generation. For example, the temperature of a 5G base station’s chip can exceed 80°C. Training an AI model using ChatGPT-4.5 requires thousands of GPUs working simultaneously, and their temperatures can go above 90°C! Without efficient cooling solutions, these devices would frequently crash or even get damaged.

Project Requirements

To address these issues, what’s needed is a thermal conductive material that can efficiently transfer heat while maintaining stability at high temperatures. Such a material is essential for high-power-consuming devices like 5G base stations and AI servers. Chenxi CX-3180AB, a specially designed silicone gel for heat conduction, was developed precisely to meet this need. Whether it’s base station chips operating at 80°C or GPU clusters running at 90°C, CX-3180AB helps to keep them cool and ensures their stable operation, acting as a reliable, invisible guardian behind the scenes!

CX-3180AB High Thermal Conductivity Silicone Gel: A Versatile Solution for Heat Dissipation

CX-3180AB is a silicone gel specifically designed for high-conductivity thermal interface applications. Its excellent properties have made it a leading product in the heat dissipation industry. Its key advantages include:  

  • Low viscosity and high fill rate: With 96% filler content, it maximizes the synergistic effect between the oil and powder, thereby increasing the thermal conductivity. This allows for the creation of thermal pads or gels with thermal conductivity ranging from 8 to 13 watts. 
  • Softness and high elasticity: Despite the high filler content, the resulting thermal pads or gels retain excellent softness and elasticity. 
  • Low oil emission and low volatility: With a low molecular weight content and a ∑D3–D10 value of less than 500 ppm, it features minimal oil emission and low volatility. 
  • High reliability: It passes various tests such as double 85% RH testing, thermal shock testing, and thermal aging testing. The hardness remains stable, with changes of less than 10%.

Wide range of applications, solving various cooling challenges

The CX-3180AB is suitable not only for traditional applications such as electronic components, LED lighting, automotive electronics, and power modules, but it’s also widely used in high-performance computing devices. It fills the tiny gaps between chips and heat sinks, ensuring efficient heat transfer. Whether in industrial equipment or consumer electronics, it provides reliable heat dissipation solutions. From the Barcelona MWC to ChatGPT-4.5, it serves as the “invisible guardian” behind every technological advancement.

Chenshi Technology is committed to providing customers with innovative silicone gel solutions for heat dissipation applications. With Chenshi, you can become a master of thermal management! If you’re looking to improve the overall performance of your thermal conductive materials, please contact us to request samples.

Get in touch

If you wish to learn more about the product information, please feel free to contact us. Product Manager: Mr. Yu 177 2766 2733 (mobile phone and WeChat are the same number)