Solution
Automotive Electronics
Silicone gel CX-3425AB for heat dissipation in new energy vehicle chips
Project Background

The heat dissipation issue in new energy vehicles has always been a focal point of attention. Traditional cooling technologies can no longer meet the heat dissipation requirements of lithium batteries. Due to their unique advantages, thermal conductive silicone gaskets are receiving increasing attention as a solution to this problem. These gaskets can compensate for manufacturing tolerances, reduce the requirements for precision in radiator and heat dissipation components, and improve thermal conductivity and stability. Additionally, they offer benefits such as vibration damping, sound absorption, and electromagnetic compatibility.

Chenxi has nuxmerous customers in the automotive chip manufacturing industry who require thermal conductivity solutions. It supplies them with a range of silicone gels suitable for use as Thermal Interface Materials (TIMs). This article takes Chenshi’s best-selling two-component, addition-cured silicone gel, CX-3425AB elastomeric thermal gel, as an example to illustrate how silicone materials can be utilized to create highly efficient thermal conductive materials for automotive chips.

Project Requirements

Manufacturers of thermal conductive gaskets for automotive chips generally require that these gaskets be soft and elastic. Some customers have specific requirements as follows:

  1. The gasket should have a thickness of 3–4 mm, a Shore hardness of 0020, excellent elasticity, and low powder shedding.
  2. When the gasket is pressed onto aluminum plates under a pressure of 20 N at a temperature of 100°C for 72 hours, it should not shed any powder upon removal.
  3. The thickness and flexibility of the thermal conductive silicone gel sheet should be adjustable depending on the design requirements.

Project challenges

The difficulty of this project lies in:

  1. The customer requires that the gasket be soft and possess good elasticity and toughness. However, organic silicone gel usually loses its elasticity and toughness due to being too soft.
  2. the customer demands that the gasket does not shed powder or release oil during heat aging tests. This means the silicone gel must maintain good powder-encapsulating properties while remaining soft, and at the same time, have a low oil release rate. These are conflicting requirements that need to be balanced in the product’s properties.

Solution

After thoroughly understanding the customer’s needs, Chenxi’s service team recommended Chenxi’s thermal conductive gel, CX-3425AB. The customer successfully used CX-3425AB to produce thermal conductive silicone gaskets. These gaskets not only exhibit excellent compressive elasticity but also do not release oil or powder. The resulting gaskets were successfully applied in automotive chips.

Chenxi Thermal Conductive Gel CX-3425AB

Chenxi CX-3425AB is a two-component, addition-cured, room-temperature vulcanizing silicone elastomer gel with excellent product properties, making it ideal for producing thermal conductive gaskets with power ratings of 3 to 6 watts.  

  • High fill ratio: Low viscosity and good wetting properties enable a high fill ratio. 
  • Excellent compressive elasticity: Possesses excellent jelly-like elasticity and a high compression ratio. 
  • Superior aging resistance: Low VOC content, with ∑D3–D10 < 500 ppm, and low oil release rate. 
  • Good mechanical strength: Features excellent mechanical properties, including high toughness and effective powder encapsulation capability.

Chenxi Thermal Conduction Business:

Chenxi is China’s first high-tech enterprise dedicated to research, development, and application in the field of silicone-based thermal conductive materials. With over a decade of expertise in this industry, we have developed a range of thermal conductive silicone products, including MQ silicone resin thermal gel, elastomeric thermal gel, high-K value thermal gel, thermal gel with extremely low oil emission, thermal silicone oil, and thermal conductive additives. These products enhance the thermal conductivity of materials while also improving their mechanical and electrical insulation properties. We offer comprehensive product solutions for companies working with thermal conductive materials, helping them better address the thermal management challenges posed by next-generation electronic products.

If you’d like us to help improve the overall performance of your thermal conductive materials, please contact us to request samples.

Get in touch

If you wish to learn more about the product information, please feel free to contact us. Product Manager: Mr. Yu 177 2766 2733 (mobile phone and WeChat are the same number)