Specializing in cooling solutions for ADAS SOCs, 13W thermal conductive gel, and specialty adhesive CX-3916AB - Guangdong Chenxi New Materials Technology Co., Ltd.

Solution

Semiconductor

Specializing in cooling solutions for ADAS SOCs, 13W thermal conductive gel, and specialty adhesive CX-3916AB

Project Background

In recent years, with the rapid development of the intelligent driving automotive market and continuous advancements in autonomous driving technology, the industry is rapidly moving from L2-level assisted driving to L3 and L4 levels of advanced autonomous driving. This trend has led to a surge in the demand for computing power in intelligent driving domain controllers. Chenxi’s client is developing a high-performance, single-component thermal conductive gel for next-generation intelligent driving SOC chips. This gel boasts a thermal conductivity of 13.0 W/m·K and possesses excellent properties such as low oil permeability, low VOC content, high flow rate, and low thermal resistance. These characteristics are essential for addressing the challenging heat dissipation requirements posed by highly power-consuming chips. The specific performance requirements are as follows:

High thermal conductivity: 13 W/m·K • High extrusion rate: Extrusion rate must be at least 30 G/min
Low oil permeability: Oil leakage from one side of the gel should be less than 1 mm after 72 hours at 125°C
Low volatility: No volatiles should be released after 1,000 hours at 85°C • No external leakage, no sagging, no cracking
High reliability: Gel must withstand thermal aging tests, double 85-degree Celsius tests, and cold-hot shock tests

Project Requirements

To meet the heat dissipation requirements of intelligent driving SOC chips, the project adopted a pre-crosslinked one-component gel formulation. However, several technical challenges remain:

1、Trade-off between extrusion rate and oil release rate

Increasing the crosslinking density of the one-component gel reduces oil release rate, but this leads to insufficient extrusion flow rate. Conversely, optimizing the flow rate exacerbates oil release issues. There is a significant trade-off between these two factors.

2、Conflict between oil release rate and thermal aging performance

In existing silicone gel formulations, reducing oil leakage often results in accelerated gel hardening during thermal aging.
If thermal aging stability is prioritized (to maintain gel flexibility), oil leakage tends to exceed acceptable levels.
It is necessary to achieve both objectives: oil release of less than 1 mm on one side after 85°C/1000 hours of aging, along with a hardness change of less than 10% after 125°C/1000 hours of aging.

3、Strict requirements for low volatility

In addition to controlling oil release rate, it is essential that no volatiles are released from the gel after 85°C/1000 hours of aging. This poses additional challenges related to material purity (e.g., residual low-molecular-weight siloxanes) and crosslinking density design.

Solution

1、Balancing oil release rate and extrusion speed

CX-3916AB uses a proprietary formula that allows for precise control of cross-linking density. This enables high extrusion speeds while maintaining gel flexibility, and ensures a low oil release rate. This effectively resolves the performance contradictions associated with traditional formulas.

2、Low volatility control

High-purity raw materials with low VOC content are used to ensure that VOC levels remain below 500 ppm.
By optimizing cross-linking density, volatiles are minimized even under prolonged high-temperature conditions, meeting the strict requirement of no condensation at 85°C/1000 hours.

3. High reliability

The CX-3916AB formula optimizes the degree of primary vulcanization, reducing secondary vulcanization reactions during thermal aging. This prevents hardening or powdering caused by continuous cross-linking, ensuring long-term stability in use.

One-component thermal conductive gel adhesive: CX-3916AB

Product Overview

CX-3916AB is a low-oil-release, low-volatility addition-cured silicone thermal conductive gel. It features low viscosity, high filler content, and the ability to be heated to accelerate curing. After curing, it exhibits extremely low oil release and volatile compound levels. It also boasts excellent heat and aging resistance, as well as anti-sagging properties. It does not harden, powder, or crack even under long-term high-temperature conditions. This product is specifically designed to meet the stringent heat dissipation requirements of high-power 5G communication equipment, data centers, electric drive systems for new energy vehicles, and consumer electronics. It provides an efficient and reliable thermal management solution.

Product Features

Excellent wetting properties: Low viscosity and high powder fill rate enable rapid heat dissipation.
Ultra-low oil release: Oil diameter ratio < 1mm, ensuring long-term reliability in precision electronic devices.
Low volatility: ΣD3–D10 < 500ppm; passes 85°C/1000h test without condensation.
Stable mechanical properties: Combines excellent resilience and flexibility; prevents sagging and cracking.
Outstanding aging resistance: Stable performance in long-term high-temperature environments; no risk of hardening or powdering.

Typical Applications

Ideal for use in thermal pad and gel formulations. A perfect choice for one-component, pre-cured liquid thermal conductive gels. Suitable for applications requiring low oil leakage, low VOC levels, high flow rates, and low thermal resistance.

Professional Support

Chensil Silicone specializes in the research and development of high-performance electronic silicone materials, helping customers overcome challenges related to thermal management technology.

Get in touch

If you wish to learn more about the product information, please feel free to contact us. Product Manager: Mr. Yu 177 2766 2733 (mobile phone and WeChat are the same number)